The company participated in the 2024 second meeting of the Integrated Circuit Electromagnetic Compatibility Standards Working Group and the annual meeting of the Working Group

　　The meeting summarized the work of the working group in 2024, held an advanced commendation ceremony for the standardization working group, and deployed the work plan and work priorities for 2025. In the technical exchange agenda of the conference, participating experts shared the latest developments and typical cases in the field of international standardization of electromagnetic compatibility of integrated circuits, including electromagnetic compatibility issues between smart chips and heterogeneous integrated circuits, new antistatic devices for high-speed interfaces, and high-level integrated circuits. Topics such as electrostatic discharge testing technology. In addition, the meeting also discussed the issue of GB/TXXXXX.6 "Modeling of Electromagnetic Compatibility of Integrated CircuitsPart 6: Simulation Model of Integrated Circuit Pulse Immunity Characteristics Conducted PulseImmunity Modeling (ICIM-CPI)"(Working Group Discussion Draft), GB/TXXXXX.6" Modeling of Integrated Circuits Electromagnetic CompatibilityPart 6: Simulation Model of Integrated Circuit Pulse Immunity Characteristics Conducted PulseExtensive exchanges and discussions were conducted on integrated circuit electromagnetic compatibility technical specifications such as Immunity Modeling (ICIM-CPI)(Working Group Discussion Draft).